• Next-generation architecture for high-end defense and commercial applications such as SIGINT, EW, Comms, RADAR, Commercial Wireless, and Deep Packet Inspection
• Ultimate processing power with three Xilinx® Virtex™-6 LX240Ts or SX315Ts
• VITA 57 FMC sites for flexible I/O enhancements, including Echotek® Series multi-channel digitizer FMCs
• High-speed OpenVPXTM interface fully compatible with EnsembleTM OpenVPX modules
FPGAs
Xilinx Virtex-6 LX240T or Virtex-6 SX315T, Speed-Grade 2i
Memory
DDR-III SDRAM6 banks of 512 MB (128M x 32 at 800 MHz)
Half-duplex bandwidth (unidirectional) 3.2 GBps
Full-duplex bandwidth (bidirectional) 1.6 GBps
QDR-II SRAM
3 banks of 18 MB (4M x 36 at 500 MHz)
Full-duplex bandwidth 4.5 GBps
Datapaths
FMCs
LVDS 80 pairs at up to 1 GHz
GTX SerDes 8 lanes up to 6.25 Gb/s each
Inter-FPGA network
8 full-duplex HSDL lanes at 1.0 Gbps (1.0 GB/s) or
16 half-duplex HSDL lanes at 1.0 Gbps (2.0 GB/s)
Power
160W assumes MAX load of 30W per each of three user
programmable FPGAs:
11.7A @ 12V rail
3.0A @ 5V rail
1.5A @ 3.3V rail
Environmental
Air-Cooled – Commercial
Temperature
Operating 0°C to 40°C*
Storage -40°C to +85°C